Chip outlines and dimensions:
|
Outline |
xp5 |
xp6 |
xp7 |
xp8 |
xp9 |
xp10 |
|
Name |
|
Silicon Slice
Diameter D1 |
Φ3 |
Φ4 |
Φ5.5 |
Φ6.5 |
Φ7.5 |
Φ8 |
|
Spacer Diameter D |
Φ5+0.5or+0.2 |
Φ6+0.5or+0.2 |
Φ7+0.5or+0.2 |
Φ8+0.5or+0.2 |
Φ9+0.5or+0.2 |
Φ8 |
|
Recommended Current A |
5 |
10 |
20 |
25 |
30 |
50 |
|
Chip Height |
2+0.15or-0.15 |
2+0.15or-0.15 |
2.5+0.2or-0.2 |
2.5+0.2or-0.2 |
2.6+0.2or-0.2 |
2.6+0.2or-0.2 |
★Silicon slice diameter D1 reference dimensions, adopt polygon, denoted by the circumcircle diameter of polygon.
3. Technical Requirements:
3.1 Rating
The chip ratings (limit values) should accord with the following provisions.
|
Parameters |
Average Forward Current
IF |
Overload Current
（5s） lov |
Maximum Repetitive Peak Reverse Voltage VRRM |
Junction Temperature
Tjm |
Storage Temperature
Tstg |
|
Type |
A |
A |
V |
℃ |
℃ |
|
ZQX5 |
5 |
7 |
300 |
150 |
-40～160 |
|
ZQX10 |
10 |
14 |
|
ZQX20 |
20 |
30 |
|
ZQX25 |
25 |
35 |
|
ZQX30 |
30 |
40 |
175 |
-40～190 |
|
ZQX50 |
50 |
65 |
3.2 Characteristics
Chip characteristics should accord with the provisions in the Table 3. The characteristic values are all upper limit values.
★ Average reverse current and average forward voltage are not recommended to use.
|
Item
Parameter |
Average Forward
Current
IF (AV) |
Maximum Repetitive
Peak Reverse Voltage VRRM |
Maximum Repetitive Peak Reverse Current
25 ℃ IRRM |
Maximum Forward
Voltage
VFM |
|
Type |
A |
V |
μA |
V |
|
ZQX5 |
5 |
300
-
2000 |
1.0 |
1.1 |
|
ZQX10 |
10 |
1.0 |
|
ZQX20 |
20 |
1.5 |
|
ZQX25 |
25 |
1.5 |
|
ZQX30 |
30 |
2.0 |
1.2 |