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Copper Clad Laminate of PTFE/Glass Cloth The copper clad laminate is made from PTFE impregnated glass cloth and copper by heat pressing technique. It has excellent electrical, mechanical and heat-resistant property. It can be used as printed circuit board in radio at high frequency and in E/E devices. It conforms to the enterprise standard of Q/GHAD 5 -2007.
Specification
|
No |
Code |
Thickness |
Area |
|
1 |
CTFGCS（D）—025 |
0.25±0.02 |
300×440
or
500×500
or
520×520 |
|
2 |
CTFGCS（D）—050 |
0.50±0.03 |
|
3 |
CTFGCS（D）—080 |
0.80±0.04 |
|
4 |
CTFGCS（D）—100 |
1.0±0.04 |
|
5 |
CTFGCS（D）—125 |
1.25±0.05 |
|
6 |
CTFGCS（D）—150 |
1.5±0.07 |
|
7 |
CTFGCS（D）—200 |
2.0±0.07 |
|
8 |
CTFGCS（D）—250 |
2.5±0.07 |
|
9 |
CTFGCS（D）—300 |
3.0±0.10 |
|
10 |
CTFGCS（D）—500 |
5.0±0.15 |
|
Note: 1.CTFGCS is double side sheet, CTFGCD is one side sheet.
2 Customer’s request negotiable |
Main Properties
|
No |
Item |
Condition |
Value |
|
1 |
Surface Resistivity Ω |
Normal |
≥1×1010 |
|
Wet |
≥1×109 |
|
2 |
Resister between pins/Ω |
Normal |
≥1×1011 |
|
Wet |
≥1×109 |
|
3 |
Surface Dielectric Strength Mv/m |
Normal |
≥1.2 |
|
Wet |
≥1.1 |
|
4 |
Dissipation Factor（106HZ） |
Normal |
≤0.001 |
|
Wet |
≤0.008 |
|
5 |
Dielectric Constant（106HZ） |
Normal |
2.50~3.00* |
|
6 |
Peel Strength N/cm |
Normal |
≥15 |
|
Pre-processing |
≥13 |
|
After Dip Soldering |
≥13 |
|
7 |
Dip Soldering-resistance |
|
No delamination ,
No Bubble |
|
Note: Customer’s request negotiable |
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