High Dielectric Constant Copper Clad Laminate of PTFE Glass Cloth
He copper clad laminate is made from filled PTFE impregnated glass cloth and copper by heat-cladding method. It is suitable for printed circuit board that works at the condition of high temperature and frequency. .It conforms to the enterprise standard of Hε PCB. It conforms to the enterprise standard of Q/GHDA 91-2008.
Specification Unit：mm
|
Code |
Thickness |
Area |
|
WCTFG—0.5（S/D） |
0.50±0.04 |
300 X 440 |
|
WCTFG—1.0（S/D） |
1.00±0.04 |
|
WCTFG—1.5（S/D） |
1.50±0.07 |
|
WCTFG—2.0（S/D） |
2.00±0.07 |
|
Note: S— One-side Copper Clad; D— Double-side Copper clad |
Main Properties
|
Item |
Value |
|
Dissipation Factor /（106HZ） |
≤3.0×10-3 |
|
Dielectric Constant /（106HZ） |
3.00~3.55 |
|
Surface Resistivity Ω |
≥1.0×1013 |
|
Volume Resistivity Ω·m |
≥1.0×1011 |
|
Water Absorption % |
≤0.05 |
|
Peel Strength N/cm |
≥8.0 |